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MSI Mobile PadPRODUCT FEATURES: Easily assembled on socket 754 motherboards with any K8 cooler; Support AMD mobile CPU up to 40W heat transition design; Designed with pure 1/4 H soft copper for best contact interface; Faster conducted heat to cooler with great thermal PAD design; Better heatsink performance to overclock Turion processors; Build up a quiet PC system with outstanding heatsink quality; Support small factor K8 cooler to build a small PC platform. More MSI PC accessories
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